Electronic component mounting method providing a substrate standby area
US8789265B2 · kind B2 · utility
2Cited by
9References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 19, 2008 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Feb 14, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53187
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electronic component mounting system including a plurality of electronic component mounting apparatuses coupled in series, the system mounting an electronic component on a substrate to manufacture a mounted substrate, a substrate carried into a mounting conveyor is temporarily placed in a standby state in a substrate standby area formed by a first transfer conveyor (carry-in conveyor) of one electronic component mounting apparatus and a second transfer conveyor (carry-out conveyor) of another electronic component mounting apparatus positioned upstream of the one electronic component mounting apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.