Process for preparing, prior to filling, a wafer cornet, cornet thus obtained and installation for implementing the process
US8789489B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 23, 2013 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | May 23, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB65B7/18
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Process for preparing a cornet consisting of a substantially conical wafer (22) prior to filing of said cornet with an ice-cream; in order to preserve the crunchy nature of the wafer, the inner wall of the cornet is sprayed with liquid chocolate (23); this chocolate solidifies rapidly in order to form a coating layer for separating the wafer and the ice-cream. The process is characterized in that the inside of the cornet is sprayed with an excess quantity of chocolate to guarantee that no coating-gap zone remains on the inner wall of the wafer, the excess liquid chocolate collecting, under gravity, at the bottom tip of the corner, prior to solidification of said excess, the excess is sucked out of the cornet, subsequent solidification of the coating layer thus making it possible to establish a continuous barrier over the inner wall or the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.