Cooling structure for electric device
US8789578B2 · kind B2 · utility
1Cited by
42References
3Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2006 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Apr 24, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A cooling structure for an electric device includes a plurality of cooling medium paths (724) through which a cooling medium for an inverter flows, an inlet (722) into which the cooling medium to be supplied to the plurality of cooling medium paths (724) flows, and a wall (726) provided between the inlet (722) and the plurality of cooling medium paths (724) to promote distribution of the cooling medium to each of the cooling medium paths (724).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.