Method and device for machining workpieces
US8790157B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 18, 2013 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Feb 18, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B19/08
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method for grinding the surface of non-round workpieces. The method includes the steps of clamping a workpiece within a machining unit; machining the workpiece; without unclamping the workpiece, contactlessly measuring the workpiece using an optical measuring device having a conoscopic holography sensor with a characteristic measuring range; and machining and measuring the workpiece in an alternating manner to iteratively approach the desired measurements of a specified form by adjusting the distance between the optical measuring device and the surface of the workpiece depending on there being a deviation of the surface from the specified form so that a respectively measured area of the surface of the workpiece remains within the measuring range of the optical sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.