Securable implantable component
US8790409B2 · kind B2 · utility
99Cited by
0References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 7, 2012 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Dec 7, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2460/13
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Implantable components configured to be secured to a recipient with a bonding agent are presented herein. The implantable components are configured to be implanted adjacent to a recipient's bone and/or tissue and have a surface for attachment to the bonding agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.