Mold-free resin-insulated coil windings
US8790476B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 19, 2008 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Jan 11, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01F41/127
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
Mold-free resin-insulated coil windings are obtained by applying continuous fibers embedded in a quasi-solid-state epoxy-resin matrix, e.g. in the form of a tape, to the coil windings. The tape is locally heated up to the melting point of its polymer matrix, and is subsequently pressed against the winding body. The heated and fused resin of the tape, which is pressed onto the coil, flows under pressure into the voids and gaps between the coil windings and fills them up, thereby hermetically insulating the coil windings. After leaving the heating and pressing apparatus the fused epoxy resin becomes solid again. The resulting curing process is thus considerably simplified and shortened, compared to the state of the art.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.