Metal polishing slurry and method of polishing a film to be polished
US8791019B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 27, 2006 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Nov 10, 2030 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC11D2111/22
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a metal polishing liquid capable of CMP at a high Cu polishing rate and solving the problems: (a) generation of scratches attributable to solid particles, (b) generation of deteriorations in flatness such as dishing and erosion, (c) complexity in a washing process for removing abrasive particles remaining on the surface of a substrate after polishing, and (d) higher costs attributable to the cost of a solid abrasive itself and to waste liquid treatment, as well as a method of polishing a film to be polished by using the same. Disclosed are a metal polishing liquid which comprises a metal oxidizer, a metal oxide solubilizer, a metal anticorrosive, and a water-soluble polymer having an anionic functional group with a weight-average molecular weight of 8,000 or more and has pH 1 or more to 3 or less, and a method of polishing a film to be polished, which comprises supplying the above metal polishing liquid onto a polishing cloth of a polishing platen and simultaneously relatively moving the polishing platen and a substrate having a metallic film to be polished while the substrate is pressed against the polishing cloth.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.