On-chip thin film Zernike phase plate and applications thereof
US8791416B2 · kind B2 · utility
1Cited by
1References
15Claims
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Assignee
Inventors
Key dates
| Filing date | Dec 16, 2013 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Dec 16, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/881
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides an on-chip thin film phase plate for a releasing charging, comprising a chip substrate having one or more apertures; and a thin film layer attached to the top surface of the chip substrate. The present invention also provides a method for observing organic material by TEM, which uses the above-mentioned on-chip thin film phase plate in a TEM system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.