LED encapsulation resin body, LED device, and method for manufacturing LED device
US8791485B2 · kind B2 · utility
19Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 30, 2012 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Oct 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/854
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
An LED encapsulation resin body disclosed in the present application includes: a phosphor; a heat resistance material arranged on, or in the vicinity of, a surface of the phosphor; and a silicone resin in which the phosphor with the heat resistance material arranged thereon is dispersed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.