Package with a CMOS die positioned underneath a MEMS die
US8791531B2 · kind B2 · utility
12Cited by
2References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 21, 2011 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Oct 21, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R2499/11
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A package is provided. The package has a substrate and a cover. A MEMS die is provided having a diaphragm. A CMOS die is provided wherein at least a portion of the CMOS die is positioned between the diaphragm and the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.