Optoelectronic semiconductor chip, optoelectronic component and a method for producing an optoelectronic component

US8791548B2 · kind B2 · utility

Assignee

• OSRAM Opto Semiconductors GmbH · DE

Inventors

• Elmar Baur · Wahrenholz, DE
• Walter Wegleiter · Nittendorf, DE

Key dates

• Filing date: Sep 24, 2008
• Grant date: Jul 29, 2014
• Expiry date: Jan 10, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10H20/84
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor chip is specified that has a contact layer that is not optimum for many common applications. For example, the contact layer is too thin to tolerate an operating current intended for the semiconductor chip without considerable degradation. Also specified is an optoelectronic component in which the semiconductor chip can be integrated so that the suboptimal quality of the contact layer is compensated for. In the component the semiconductor chip is applied to a carrier body so that the contact layer is arranged on a side of the semiconductor body that is remote from the carrier body. The semiconductor chip and the carrier body are at least partly covered with an electrically isolating layer, and an electrical conductor applied to the isolating layer extends laterally away from the semiconductor body and contacts at least a partial surface of the contact layer. In addition, an advantageous process for producing the component is specified.