Heat dissipation device and radio frequency module with the same
US8792240B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 15, 2011 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Oct 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20336
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
A heat dissipation device and a radio frequency module with the same are provided. The heat dissipation device includes a substrate (1). The substrate (1) having a surface where a heat absorbing surface (5) is formed. There are multiple hollow conduits inside the substrate (1) to act as evaporating conduits (6). The heat dissipation device further comprises condensing conduits (7) intercommunicated with the evaporating conduits (6). The evaporating conduits (6) and the condensing conduits (7) form sealed conduits. The sealed conduits are filled with liquid which vaporizes upon heating. At least the evaporating conduits (6) are set in the substrate (1).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.