Method for providing improved power distribution or power dissipation to an electrical component attached to main circuit board
US8792248B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jun 22, 2012 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Jun 22, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/53174
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method for embedding a power modification component such as a capacitance inside of an adaptor board located to extend over and beyond the vias of the main circuit board so that a portion of the interposer board containing the embedded capacitance is located beyond where the vias or blind vias are located. This permits that via to conduct through the opening. In this way, the capacitance and the resistance will have a closer contact point to the electrical component. With this methodology a resistance can also be embedded in an opening in the adaptor board and be vertically aligned within the opening to make contact with a pad on top of the adaptor board and a pad at the bottom of the adaptor board so that electricity conducts through the embedded component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.