Light transmission path package, light transmission module, electronic device and method for manufacturing light transmission module
US8792755B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 12, 2008 |
| Grant date | Jul 29, 2014 |
| Priority date | — |
| Expiry date | Nov 28, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/853
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A light transmission path package includes first and sealing surface adjustment members, which are arranged with facing each other by way of a light emitting/receiving element on a lead frame substrate, having a length in a normal direction of the substrate surface from the substrate surface of H2; wherein a relational expression H3<H2<H1 is satisfied where the height H1 is a distance in the normal line direction from the substrate surface to a surface of the light guide facing the substrate surface, and the height H3 is a length in the normal line direction from the substrate surface in the light emitting/receiving element. The sealing resin is filled so as to cover the first and second sealing surface adjustment members and so as not to come in contact with the light transmission path.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.