Patent · US Active

Sensor module and method for producing a sensor module

US8794074B2 · kind B2 · utility

1Cited by

13References

14Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Eric Ochs · St. Clair Shores, US
Frieder Haag · Wannweil, DE
Eckart Schellkes · Kirchentellinsfurt, DE

Key dates

Filing date	Nov 2, 2009
Grant date	Aug 5, 2014
Priority date	—
Expiry date	Nov 20, 2031

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3025
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A sensor module is provided having a sensor element, a housing and a substrate, the sensor element being situated on the substrate and the sensor element is provided to be at least partially embedded in the housing; and the sensor module further having a compensation element for compensating for thermal deformations of the housing; the housing being essentially situated between the substrate and the compensation element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.