Patent · US Active

Method and apparatus for forming bundles in a bundle former

US8794134B2 · kind B2 · utility

0Cited by
7References
13Claims
0Family size

Assignee

Inventors

Key dates

Filing dateMar 25, 2011
Grant dateAug 5, 2014
Priority date
Expiry dateJun 2, 2032

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB65H2511/20
  • WIPO fieldHandling
  • WIPO sectorMechanical engineering

Abstract

An apparatus for a forming bundle composed of at least one layer of printed products includes a lift, wherein an area above the lift constitutes a holding space to accommodate the at least one layer. The lift is adapted to lower the at least one layer. A control unit is connected to control movement of the lift. A thickness determining device is coupled to the control unit and arranged to determine a thickness of the at least one layer. The lift is controlled to be lowered corresponding to a previously determined thickness of a layer to accommodate a following layer of a bundle or to accommodate a layer of a following bundle.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.