Large-sized front opening unified wafer POD
US8794444B2 · kind B2 · utility
2Cited by
9References
33Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 2, 2011 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Jan 28, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67379
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A FOUP (front opening unified pod) is disposed with a plurality of supporting pieces, the positions of which are calibrated to be symmetrical for the supporting pieces to horizontally support wafers in the pod, and with an OHT pad (overhead hoist transport pad), a major function of which is to evenly distribute the weight of the FOUP and the wafers so that the transportation of the FOUP and the wafers by the OHT head can be further stabilized and more weight can be loaded to meet the demands of the process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.