Method of transferring a light emitting diode
US8794501B2 · kind B2 · utility
267Cited by
80References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2012 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Feb 15, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/819
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.