Patent · US Active

Multi-film adhesive design for interfacial bonding printhead structures

US8794743B2 · kind B2 · utility

1Cited by
10References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 30, 2011
Grant dateAug 5, 2014
Priority date
Expiry dateJan 4, 2032

Classification

  • Technology area (CPC B)Performing Operations; Transporting
  • CPC primaryB41J2/1623
  • WIPO fieldTextile and paper machines
  • WIPO sectorMechanical engineering

Abstract

In accordance with aspects of the present disclosure, a printhead assembly arranged to dispense ultraviolet curable ink or gel ink and method thereof is disclosed. The printhead assembly includes a plurality of functional plates stacked together; a first adhesive layer arranged between adjacent functional plates to provide bonding between the plates; and a second adhesive layer arranged between adjacent function plates to provide chemical resistance to the ultraviolet curable ink or the gel ink.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.