Lapping carrier and method
US8795033B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2012 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Dec 3, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/28
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Provided is a lapping carrier including a base carrier having a first major surface, a second major surface and at least one aperture for holding a workpiece. The aperture extends from the first major surface through the base carrier to the second major surface. The base carrier includes a first metal or a polymer. At least a portion of the first major surface or at least a portion of each of the first and the second major surfaces includes a polymeric region. In at least a portion of the polymeric region, at least one adhesion promoting layer is interposed between the polymeric region and the base carrier. The adhesion promoting layer includes an inorganic coating.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.