Chemical mechanical planarization pad conditioner and method of forming
US8795035B2 · kind B2 · utility
0Cited by
6References
17Claims
0Family size
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Key dates
| Filing date | Jun 25, 2009 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Dec 12, 2031 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B53/017
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A CMP pad conditioner including a substrate having a transparency window represented by an average internal transmittance of not less than about 90% over a wavelength range extending from about 400 nm to about 500 nm along a path length extending through the substrate of not less than about 10 mm a bonding layer overlying a surface of the substrate, and abrasive grains contained within the bonding layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.