Bonded patches with bond line control
US8795455B2 · kind B2 · utility
2Cited by
28References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 4, 2009 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Sep 4, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24322
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A patch may be used to rework a composite structure in the field. The patch is bonded to the structure by a layer of adhesive and includes perforations that allow the escape of air from the adhesive as the patch is compressed against the structure. A spacer may be introduced between the patch and the structure to control the thickness of the adhesive layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.