Low thermal distortion silicone composite molds
US8795560B2 · kind B2 · utility
1Cited by
9References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 9, 2007 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Oct 24, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/50
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention provides compositions and methods that may be used to form low thermal distortion molds. The composition may include a curable elastomeric silicone composition formed using a de-volatilized polymer and at least one de-volatilized cross-linker. One embodiment of the method may include forming a pattern on a first side of an elastomer that is impregnated with a fibrous material proximate a second side of the elastomer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.