Method and apparatus for manufacturing white light-emitting device
US8796050B2 · kind B2 · utility
5Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 28, 2011 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Jan 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0361
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods and apparatus for manufacturing a semiconductor light-emitting device that emits white light by forming a phosphor layer on an emission surface of the semiconductor light-emitting device at a wafer-level. The method includes: forming a plurality of light-emitting devices on a wafer; thinning the wafer, on which the plurality of light-emitting devices are formed; disposing the thinned wafer on a carrier film; and forming a phosphor layer on an emission surface of the plurality of light-emitting devices on the wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.