Methods for vacuum assisted underfilling
US8796075B2 · kind B2 · utility
7Cited by
26References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 13, 2012 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Jul 13, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01029
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Methods for applying an underfill with vacuum assistance. The method may include dispensing the underfill onto a substrate proximate to at least one exterior edge of an electronic device attached to the substrate. A space between the electronic device and the substrate is evacuated through at least one gap in the underfill. The method further includes heating the underfill to cause the underfill to flow into the space. Because a vacuum condition is supplied in the open portion of the space before flow is initiated, the incidence of underfill voiding is lowered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.