Patent · US Active

Pressure-sensitive hot-melt adhesives adhering to flexible substrates

US8796377B2 · kind B2 · utility

2Cited by

10References

15Claims

0Family size

Assignee

Henkel AG & Co. KGaA · DE

Inventors

Holger Tonniessen · Niederzier, DE
Annie Seiler · Bayeux, FR
Rainer Rauberger · Mülheim an der Ruhr, DE
Ralf Grauel · Hilden, DE

Key dates

Filing date	May 12, 2009
Grant date	Aug 5, 2014
Priority date	—
Expiry date	Oct 26, 2030

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08L2666/24
WIPO fieldBasic materials chemistry
WIPO sectorChemistry

Abstract

The invention relates to a hot melt pressure sensitive adhesive. The hot melt pressure sensitive adhesive is particularly well suited for flexible substrates such as plastic and paperboard packaging.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.