Encapsulated cure systems
US8796381B2 · kind B2 · utility
8Cited by
2References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2011 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Sep 17, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Encapsulated cure systems are provided wherein a curative is incorporated into a solid or semi-solid carrier material whereby mere fracturing or failure of the capsule wall encapsulating such cure systems will not provide for or allow sufficient release of the curative. Also provided are adhesive systems incorporating said encapsulated cure systems.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.