In-line package apparatuses and methods
US8796597B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 2008 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Nov 4, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An in-line package apparatus includes a first treating unit, an input storage unit, a heating unit and an output storage unit. The first treating unit performs a ball attach process or a chip mount process. A processing object that a process is completed in the first treating unit is received in a magazine so as to be vertically stacked and a plurality of magazines each having one or more processing objects is stored in an input stacker. The heating unit performs a reflow process on the processing objects in the magazine stored in the input stacker by an induction heating method. A processing object that a reflow process is completed is received in a magazine and then stored in an output stacker.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.