Patent · US Active

Hybrid intergrated component and method for the manufacture thereof

US8796791B2 · kind B2 · utility

0Cited by

1References

9Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Axel Franke · Ditzingen, DE
Patrick Wellner · Neckartenzlingen, DE
Lars Tebje · Reutlingen, DE

Key dates

Filing date	May 7, 2013
Grant date	Aug 5, 2014
Priority date	—
Expiry date	May 7, 2033

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB81C2203/0109
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

Measures are proposed by which the design freedom is significantly increased in the case of the implementation of the micromechanical structure of the MEMS element of a component, which includes a carrier for the MEMS element and a cap for the micromechanical structure of the MEMS element, the MEMS element being mounted on the carrier via a standoff structure. The MEMS element is implemented in a layered structure, and the micromechanical structure of the MEMS element extends over at least two functional layers of this layered structure, which are separated from one another by at least one intermediate layer.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.