Electronic component and producing method thereof
US8797711B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2009 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Dec 14, 2030 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49117
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A region where a plating film constituting an external electrode is formed can be accurately controlled in an electronic component in which the external electrode is formed by directly plating a particular region in a surface of a component body. In a component body, a bump is provided in a position in which a region where an external electrode should be formed is partitioned. In a plating process, growth of the plating film constituting the external electrode is substantially stopped or delayed in the bump. As a result, a termination point of the growth of the plating film constituting the external electrode can be accurately controlled in the position of the bump.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.