Integrated overmolded interconnect tab for surface-mounted circuits
US8797756B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2011 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Apr 18, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An integrated interconnect tab that provides a mechanically repeatable connection point to electrical components mounted on a printed circuit board. The integrated interconnect tab comprises a conductive pad surrounded by a vertical sidewall structure formed in an overmolded insulating layer. In one embodiment, a large pad accommodates connections to high-power circuit elements such as batteries and high-voltage capacitors. The sidewall structure helps align and guide the position of an interconnecting device such as a wire ribbon connector, facilitating automation of a subsequent attachment process. An automated method of making a PCB assembly having integrated interconnect tabs entails attaching circuit elements and interconnect tabs to a surface of a PCB substrate, encapsulating the attached components, and selectively machining the encapsulating layer to expose weld tabs, to form the vertical sidewall structure surrounding the tabs, and to create mechanical retention features to aid in welding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.