Optical transmitter with flip-chip mounted laser or integrated arrayed waveguide grating wavelenth division multiplexer
US8798409B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 12, 2010 |
| Grant date | Aug 5, 2014 |
| Priority date | — |
| Expiry date | Aug 6, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4031
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An optical communication system comprising first and second planar substrates and an alignment assembly. The first substrate of a semiconductor material, is located on a planar surface of a sub-mount and having a planar first edge. The second substrate of a different second material, is located on said planar surface of said sub-mount and having a planar second edge. The alignment assembly is located on said sub-mount, said alignment assembly including rigid standoff structures configured to fixedly vertically align said first and second edges above said sub-mount such that each optical output of one of said lasers is vertically aligned with the end of one of said light-guiding structures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.