Patent · US Active

Heat dissipation apparatus with heat pipe

US8800639B2 · kind B2 · utility

1Cited by
6References
8Claims
0Family size

Assignees

Inventors

Key dates

Filing dateOct 11, 2011
Grant dateAug 12, 2014
Priority date—
Expiry dateOct 3, 2032

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2924/0002
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

An exemplary heat dissipation apparatus includes a number of fins and a heat pipe. Each fin defines a through hole therein. A collar extends from each fin at an edge of the through hole. The collar inclines toward a center of the through hole. An inner diameter of the collar gradually decreases along a direction away form the fin. A diameter of the heat pipe is larger than a minimum inner diameter of the collar when the collar in a natural state. When the heat pipe extends through the through hole of the fin, the collar is pushed by the heat pipe to expand outwardly, so that the heat pipe intimately contacts an inner face of the collar.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.