Ultrasonic bonding
US8800846B2 · kind B2 · utility
3Cited by
21References
17Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 28, 2013 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Feb 24, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K20/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The described embodiment relates generally to the field of ultrasonic bonding. More specifically, an apparatus for bonding a number of wires directly to a metal substrate in a single operation without the use of any kind of adhesive or solder is disclosed. The apparatus is an ultrasonic bonder. The ultrasonic bonder has a horn with a cavity specifically sized for the number of wires to be bonded. The ultrasonic bonder is driven at a frequency that corresponds to a resonant frequency of the wires to be bonded.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.