Module socket
US8801439B2 · kind B2 · utility
4Cited by
2References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 20, 2012 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Oct 4, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/7076
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The Present Disclosure is a module socket for mounting a module on a mounting member, in which the module socket has a first connector including a flat housing, a first conductive pattern arranged on the mating side surface of the housing, and a male terminal protruding from a surface of the first conductive pattern, and a flat second connector formed from plate-shaped metal and including a female terminal elastically interposing the male terminal, and in which either the first conductor or the second conductor is attached to the module and the other is attached to the mounting member.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.