Method of making wear-resistant printed wiring member
US8801914B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 2011 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Sep 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/049
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for making a printed wiring member including wire-bondable contact pads and wear-resistant connector pads, the method includes a) providing a blank printed wiring member comprising a copper foil laminated to a dielectric substrate; b) masking the blank printed wiring member to protect regions of the copper foil; c) removing copper in unprotected regions of the blank printed wiring member to form a patterned printed wiring member including contact pads and connector pads; d) depositing a nickel coating on the patterned printed wiring member; e) electrolytically depositing a hard gold layer on the nickel coating; and f) depositing palladium on a surface of the hard gold layer to improve bondability of the contact pads while preserving wear resistance of the connector pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.