Fabrication method of flexible devices
US8801997B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2011 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Dec 14, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/6835
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a method of fabricating a flexible device, which includes surface-treating one or both sides of a carrier plate so that regions with different surface-treatments are formed on the same side of the carrier plate, forming a glass-filler reinforced plastic substrate film on the surface-treated carrier plate, forming thin film patterns on the glass-filler reinforced plastic substrate film, and separating the glass-filler reinforced plastic substrate film having the thin film patterns formed thereon from the carrier plate, and in which the surface-treating of the carrier plate enables the glass-filler reinforced plastic substrate film to be easily separated from the carrier plate without an additional process such as using a solvent or a laser release technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.