Housing for electronic devices and method for making housing
US8802220B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Aug 3, 2012 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Aug 3, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24901
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A housing for an electronic device includes a substrate made of plastic, a base paint layer, a pattern layer, a tin layer, a silicon oxide layer, and a top paint layer. The substrate has an outer surface and an inner surface opposite to the outer surface and facing the interior of the electronic device. The base paint layer is formed on the outer surface. The pattern layer is directly formed on the base paint layer and partially covers the base paint layer. The tin layer is directly formed on the pattern layer and covers the pattern layer and portions of the base paint layer not covered by the pattern layer. The silicon oxide layer is directly formed on the entire tin layer. The top paint layer is formed on the silicon oxide layer. A method for making the housing is also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.