Horizontally graded structures for electrochemical and electronic devices
US8802321B2 · kind B2 · utility
1Cited by
5References
38Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2008 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Jul 26, 2029 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1089
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The present invention provides a graded multilayer structure, comprising a support layer (1) and at least 10 layers (2, 3) forming a graded layer, wherein each of the at least 10 layers (2, 3) is at least partially in contact with the support layer (1),
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.