Mixed mode ligands
US8802448B2 · kind B2 · utility
2Cited by
9References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 23, 2012 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Jul 23, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P20/582
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
Substrates comprising a solid support, a ligand, and a linker comprising at least one C, O, N, or S atom covalently connecting the solid support to the ligand, are disclosed, along with methods of using and making the substrates, and devices including the substrates.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.