Embedded printed circuit board and manufacturing method thereof
US8802999B2 · kind B2 · utility
1Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 23, 2012 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Oct 19, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1461
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An embedded printed circuit board (PCB) includes: a copper foil laminate; an internal electronic component inserted into the copper foil laminate; a first circuit pattern formed on a surface of the internal electronic component; and a second circuit pattern formed on the copper foil laminate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.