Patent · US Active

Bond pad monitoring structure and related method of detecting significant alterations

US8803145B2 · kind B2 · utility

4Cited by

3References

16Claims

0Family size

Assignee

STMicroelectronics SA

Inventors

Davide Giuseppe Patti · Mascalucia, IT
Manuela Larosa · Giarre, IT

Key dates

Filing date	Aug 30, 2012
Grant date	Aug 12, 2014
Priority date	—
Expiry date	Sep 12, 2032

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/3011
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A passive bond pad condition sense structure may be configured to be electrically stimulated and tested for detecting an anomalous or altered electrical characteristic caused by stress or aging of the bond pad capacitively coupled to it. The related bond pad condition testing or monitoring system may include relatively simple stimulating and sensing circuits that may be wholly embedded in the integrated circuit device.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.