Structure of AC light-emitting diode dies
US8803166B2 · kind B2 · utility
7Cited by
6References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 23, 2010 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Feb 23, 2031 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An arrangement of light emitting diodes including a first micro-die, a second micro-die, a first bridge, a second bridge and a substrate supporting the first micro-die and the second micro die. The first micro-die includes a first edge having a first end and a second end, a second edge opposite and not parallel to the first edge, a first connecting portion near the first end, and a second connecting portion near the second end.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.