Macro channel water-cooled heat-sink for diode-laser bars
US8804781B2 · kind B2 · utility
9Cited by
23References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2012 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Oct 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4018
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A diode-laser bar is mounted on water-cooled heat-sink between two ceramic sub-mounts for electrically isolating cooling-water in the heat-sink from the diode-laser bar. Mounting between the two ceramic sub-mounts also provides for balancing stresses due to differences in coefficient of thermal expansion (CTE) between the sub-mounts and the diode-laser bar. Both sub-mounts are in thermal communication with the heat-sink for providing two-sided cooling of the diode-laser bar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.