Macro-channel water-cooled heat-sink for diode-laser bars
US8804782B2 · kind B2 · utility
8Cited by
22References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2012 |
| Grant date | Aug 12, 2014 |
| Priority date | — |
| Expiry date | Oct 29, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/42
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A water-cooled heat-sink for a diode-laser bar includes a copper-cooling-unit having an integral mount thereon for the diode-laser bar. The copper-cooling-unit is attached to a steel base-unit. The base-unit and the cooling-unit are cooperatively configured such that at least one cooling-channel is formed in the cooling-unit by the attachment of the base-unit to the cooling-unit. The cooling-channel is positioned to cool the mount when cooling-water flows through the cooling-channel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.