Mechanical packaging technique of attaching MEMS and flex circuit
US8806925B2 · kind B2 · utility
0Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2012 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Sep 22, 2032 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01L23/145
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention disclosed provides for a rugged, compact sensing device for various implementations including those of automotive, marine, and other combustion technologies that require low cost accurate pressure sensing during internal combustion engine process. In one or more aspects of the present invention, a MEMS sensor connection with a flexible circuit is presented and the communication of which is preferably achieved through the use of wire bond technology.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.