Method for printing a conductor in two superimposed layers by screen-printing
US8807026B2 · kind B2 · utility
1Cited by
14References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 31, 2010 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Oct 12, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F77/211
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
Method for printing on a wafer (1) by screen-printing, characterized in that it comprises the following steps:
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.