Titanium-based thermal ground plane
US8807203B2 · kind B2 · utility
22Cited by
5References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 21, 2009 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Apr 6, 2031 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldThermal processes and apparatus
- WIPO sectorMechanical engineering
Abstract
Titanium-based thermal ground planes are described. A thermal ground plane in accordance with the present invention comprises a titanium substrate comprising a plurality of pillars, wherein the plurality of Ti pillars can be optionally oxidized to form nanostructured titania coated pillars, and a vapor cavity, in communication with the plurality of titanium pillars, for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.