High density connector structure for transmitting high frequency signals
US8808029B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2013 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Apr 25, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R12/724
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A high density connector structure for transmitting high frequency signals having a first sub-assembly, a second sub-assembly, a shield plate, and a shield shell is disclosed. The first sub-assembly has a plurality of first contacts held in a first insulator, and the second sub-assembly has a plurality of second contacts held in a second insulator. The shield plate is positioned between the first and second contacts. At least one resilient arm extends from said shield plate and contacts at least one of the first contacts of the first sub-assembly. The shield shell at least partially surrounds the periphery of the first and second sub-assemblies.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.