Copper containing algicidal compounds
US8808756B2 · kind B2 · utility
0Cited by
5References
47Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2007 |
| Grant date | Aug 19, 2014 |
| Priority date | — |
| Expiry date | Jan 31, 2028 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/256
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present application is directed to a coating composition comprising a ceramic binder and inorganic copper compound particles. Generally, the inorganic copper compound particles have a median particle size of less than 5 micrometers. In some embodiments, the particles have a median particle size of greater than 1 micrometer. The inorganic copper compound particles may be non-photocatalytic. The coating may also be placed on a structural layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.